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2007
Model No.
VDR-D50P
VDR-D50PC
VDR-D50EG
VDR-D50E
VDR-D50EB
VDR-D50EP
VDR-D50EE
VDR-D50EF
VDR-D50GC
VDR-D50GCS
VDR-D50GN
VDR-D50GT
VDR-D50SG
VDR-D50PL
VDR-D51EE
VDR-D58GK
VOL.1
Colour
(S)....................Silver Type
(S)....................Silver Type
DVD Video Camera
ORDER NO.VM0712051CE
B17
1 Safety Precaution
3
1.1.
General Guidelines
3
2 Warning
4
2.1.
Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
4
2.2.
Service caution based on legal restrictions
5
2.3.
Caution for AC Cord (For EB/GC/GCS/SG)
6
2.4.
How to Replace the Lithium Battery (PROCEDURE)
7
2.5.
How to Recycle the Lithium Battery (U.S. Only)
8
3 Service Navigation
9
3.1.
Service Information
9
3.2.
Service Caution
10
3.3.
Procedure for Removing Disc
11
4 Specifications
12
5 Location of Controls and Components
13
6 Service Mode
15
6.1.
Error Display
15
6.2.
Service Menu
16
7 Service Fixture & Tools
18
7.1.
Service Tools and Equipment
18
8 Disassembly and Assembly Instructions
19
8.1.
Disassembly Frow Chart
19
8.2.
P.C.B. Layout
20
8.3.
Disassembly Procedures
21
8.4.
Disassembly Procedures of Camera Lens Unit
27
9 Measurements and Adjustments
28
9.1.
EEPROM Data for spare parts of the MAIN P.C.B.
28
9.2.
Service Positions
28
9.3.
Location for Connectors of the Main P.C.B.
30
9.4.
Electrical Adjustment Procedures
31
10 Maintenance
34
10.1. Cleaning Lens, Viewfinder and LCD Panel
34
10.2. Cleaning Disc
34
10.3. Cleaning optical pickup
34
11 Schematic Diagrams
37
11.1. OVERALL SCHEMATIC DIAGRAM
37
11.2. INTERCONNECTION SCHEMATIC DIAGRAM
38
11.3. FRONT SCHEMATIC DIAGRAM
39
11.4. LCD BACKLIGHT SCHEMATIC DIAGRAM
40
11.5. EVF BACKLIGHT SCHEMATIC DIAGRAM
41
11.6. EVF FPC SCHEMATIC DIAGRAM
41
11.7. DISC COVER LOCK UNIT SCHEMATIC DIAGRAM
41
11.8. SIDE L UNIT SCHEMATIC DIAGRAM
41
11.9. REAR CASE UNIT SCHEMATIC DIAGRAM
42
11.10. CCD SCHEMATIC DIAGRAM
42
11.11. LCD SHAFT FPC SCHEMATIC DIAGRAM
42
12 Printed Circuit Board
43
12.1. EVF BACKLIGHT P.C.B.
43
12.2. FRONT P.C.B.
44
12.3. LCD BACKLIGHT P.C.B.
45
13 Parts and Exploded Views
47
13.1. Exploded Views
47
13.2. Replacement Parts List
53
CONTENTS
Page
Page
2
VDR-D50P
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M
W and 5.2MW. When the exposed metal does not have
a return path to the chassis, the reading must be infinity.
1.1.2. Leakage current hot check (See
Figure 1)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect “A” to exposed metallic part on the set. And
connect “B” to a good earth ground, as shown in Figure 1.
3. Use an AC voltmeter, with 1 k
W/V or more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.25 V RMS.
A leakage current tester (Simpson Model 229 or equivalent)
may be used to make the hot checks, leakage current must
not exceed 1/2 mA. In case a measurement is outside of
the limits specified, there is a possibility of a shock hazard,
and the equipment should be repaired and rechecked
before it is returned to the customer.
may be used to make the hot checks, leakage current must
not exceed 1/2 mA. In case a measurement is outside of
the limits specified, there is a possibility of a shock hazard,
and the equipment should be repaired and rechecked
before it is returned to the customer.
Figure 1
1 Safety Precaution
1.1. General Guidelines
1. IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by in the
Schematic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
Schematic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
2. An Isolation Transformer should always be used during the servicing of AC Adaptor whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury
from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
3. When servicing, observe the original lead dress. It a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
4. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
5. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
3
VDR-D50P
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
sufficient to damage an ES device).
4
VDR-D50P
