Read Panasonic SDR-S45EG / SDR-S45EF / SDR-S45EC / SDR-S45EP / SDR-S45EB / SDR-S45EE / SDR-S45GC / SDR-S45GA / SDR-S45GN / SDR-S45PU / SDR-S45PR Service Manual online
SDR-S45EF
SDR-S45EC
SDR-S45EP
SDR-S45EB
SDR-S45EE
SDR-S45GC
SDR-S45GA
SDR-S45GN
SDR-S45PU
SDR-S45PR
(S)........Silver Type
2.3. Caution for AC Cord (For EB/GC/GA) ----------------6
2.4. How to Replace the Lithium Battery
3.2. How to Define the Model Suffix (NTSC or PAL
5 Location of Controls and Components------------------ 12
6 Service Mode ----------------------------------------------------- 15
6.2. Power ON Self Check Result Display--------------- 16
6.3. Lock Search History Clear ----------------------------- 17
8.2. P.C.B. Layout---------------------------------------------- 19
8.3. Disassembly Procedures------------------------------- 20
8.4. Disassembly Procedures of Camera Lens
9.3. Location for Connectors of the Main P.C.B. ------- 31
9.4. Electrical Adjustment ------------------------------------ 32
11.2. What is the factory settings? -------------------------- 35
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
injury from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
chassis, the reading should be between 1M
lent) may be used to make the hot checks, leakage cur-
rent must not exceed 1/2 mA. In case a measurement is
outside of the limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and
rechecked before it is returned to the customer.
(ES) Devices
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-
conductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
which should be removed for potential shock reasons prior to applying power to the unit under test.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
ble conductive material).
CAUTION:
ficient to damage an ES device).