Read Panasonic SDR-S10P / SDR-S10PC / SDR-S10PL / SDR-S10E / SDR-S10EB / SDR-S10EE / SDR-S10EF / SDR-S10EG / SDR-S10EP / SDR-S10GC / SDR-S10GN / SDR-S18GK Service Manual online
SDR-S10PC
SDR-S10PL
SDR-S10E
SDR-S10EB
SDR-S10EE
SDR-S10EF
SDR-S10EG
SDR-S10EP
SDR-S10GC
SDR-S10GN
SDR-S18GK
(K)...........Black Type
1.2. Leakage Current Cold Check ---------------------------3
1.3. Leakage Current Hot Check (See Figure 1.) --------3
2.4. How to Replace the Lithium Battery -------------------6
3.2. General Description About Lead Free Solder
5 Location of Controls and Components ------------------ 11
6 Service Mode ----------------------------------------------------- 12
7.2. Service Position ------------------------------------------ 14
8.2. PCB Location---------------------------------------------- 15
8.3. Disassembly Procedure -------------------------------- 16
which are important for safety. These parts are marked by
tial that these critical parts should be replaced with manu-
facturer’s specified parts to prevent X-RADIATION,
shock, fire, or other hazards. Do not modify the original
design without permission of manufacturer.
from the AC power line. Use a transformer of adequate
power rating as this protects the technician from acci-
dents resulting in personal injury from electrical shocks. It
will also protect AC Adaptor from being damaged by acci-
dental shorting that may occur during servicing.
heated or damaged by the short circuit.
properly installed.
shock hazards.
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1 M
reading must be infinity.
(See Figure 1.)
and a good earth ground, as shown in Figure 1.
lent) may be used to make the hot checks, leakage cur-
rent must not exceed 1/2 mA. In case a measurement is
outside of the limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and
rechecked before it is returned to the customer.
Sensitive (ES) Devices
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
which should be removed for potential shock reasons prior to applying power to the unit under test.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
ble conductive material).
CAUTION :