Read Panasonic HDC-SD20P / HDC-SD20PC / HDC-SD20EG / HDC-SD20EE / HDC-SD20EB / HDC-SD20EC / HDC-SD20EP / HDC-SD20GC / HDC-SD20GK / HDC-SD20PU / HDC-SD20EF / HDC-SD20GD / HDC-SD20GJ / HDC-SD20GN / HDC-SD20GT / HDC-SD20SG Service Manual online
HDC-SD20PC
HDC-SD20EG
HDC-SD20EE
HDC-SD20EB
HDC-SD20EC
HDC-SD20EP
HDC-SD20GC
HDC-SD20GK
HDC-SD20PU
HDC-SD20EF
HDC-SD20GD
HDC-SD20GJ
HDC-SD20GN
HDC-SD20GT
HDC-SD20SG
(K)........Black Type
(R)........Red Type (HDC-SD20PC/EG/EB/EC/EP/GC/
2.3. Caution for AC Cord (For EB/GC/SG) ----------------6
2.4. How to Replace the Lithium Battery
3.2. Service Caution------------------------------------------- 10
5 Location of Controls and Components------------------ 12
6 Service Mode ----------------------------------------------------- 17
6.2. About Default Setting ----------------------------------- 19
8.2. P.C.B. Layout---------------------------------------------- 21
8.3. Disassembly Procedures------------------------------- 22
8.4. Disassembly Procedures of Camera Lens
9.3. Location for Connectors of the Main P.C.B.
matic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent X-RADIATION, shock fire, or other hazards. Do not modify
the original design without permission of manufacturer.
injury from electrical shocks. It will also protect AC Adaptor from being damaged by accidental shorting that may occur during
servicing.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
chassis, the reading should be between 1M
lent) may be used to make the hot checks, leakage cur-
rent must not exceed 1/2 mA. In case a measurement is
outside of the limits specified, there is a possibility of a
shock hazard, and the equipment should be repaired and
rechecked before it is returned to the customer.
(ES) Devices
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-
conductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
which should be removed for potential shock reasons prior to applying power to the unit under test.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
ble conductive material).
CAUTION:
ficient to damage an ES device).