Read Panasonic KX-FLM553RU Service Manual online
KX-FLM553RU
(for Russia)
Multi-Function Laser Fax
ORDER NO. KMF0407789C3
1
INTRODUCTION
4
1.1.
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.2.
TRANSLATION LISTS
6
1.3.
SAFETY PRECAUTIONS
7
1.4.
INSULATION RESISTANCE TEST
7
1.5.
FOR SERVICE TECHNICIANS
8
1.6.
BATTERY CAUTION
8
1.7.
AC CAUTION
8
1.8.
PERSONAL SAFETY PRECAUTIONS
9
1.9.
SERVICE PRECAUTIONS
10
1.10. FEATURES
11
1.11. OPTIONAL ACCESSORIES
11
1.12. SPECIFICATIONS
12
1.13. TEST CHART
13
1.14. LOCATION OF CONTROLS
15
1.15. CONNECTIONS
17
1.16. INSTALLATION
18
1.17. MAINTENANCE ITEMS AND COMPONENT LOCATIONS
27
2
TROUBLESHOOTING GUIDE
31
2.1.
TROUBLESHOOTING SUMMARY
31
2.2.
USER RECOVERABLE ERRORS
32
2.3.
TROUBLESHOOTING DETAILS
36
2.4.
PROGRAMMING AND LISTS
103
2.5.
TEST FUNCTIONS
115
2.6.
CONNECTING TO A COMPUTER
119
2.7.
INSTALLING PANASONIC MULTI-FUNCTION STATION
SOFTWARE
120
2.8.
PROBLEMS WITH PC SOFTWARE
121
3
ADJUSTMENTS
122
3.1.
ADJUSTING THE FEEDER PRESSURE
122
4
DISASSEMBLY INSTRUCTIONS
123
4.1.
HOW TO REMOVE THE BOTTOM FRAME, DRUM AND
PAPER TARY
123
4.2.
HOW TO REMOVE THE OPERATION PANEL BLOCK
124
4.3.
HOW TO REMOVE THE OPERATION BOARD AND FAN
MOTOR
125
4.4.
HOW TO REMOVE THE TRANSFER ROLLER AND
IMAGE SENSOR
126
4.5.
HOW TO REMOVE THE SEPARATION RUBBER AND
DOCUMENT FEED ROLLER
126
4.6.
HOW TO REMOVE THE ANALOG BOARD, VARISTOR
BOARD, LASER SCANNING UNIT AND SPEAKER
127
4.7.
HOW TO REMOVE THE AC INLET AND LOW VOLTAGE
POWER SUPPLY BOARD
128
4.8.
HOW TO REMOVE THE DIGITAL BOARD AND MOTOR
DRIVE BOARD
129
4.9.
HOW TO REMOVE THE BACK COVER SECTION 130
4.10. HOW TO REMOVE THE FUSER UNIT AND HANDSET
CRADLE
131
4.11. HOW TO REMOVE THE MAIN FRAME AND FAN
131
4.12. HOW TO REMOVE THE HIGH VOLTAGE POWER
SUPPLY BOARD
132
4.13. HOW TO REMOVE THE HEAT ROLLER AND EXIT
ROLLER
133
4.14. HOW TO REMOVE THE PRESSURE ROLLER
134
4.15. HOW TO REMOVE THE MOTOR BLOCK
135
4.16. INSTALLATION POSITION OF THE LEAD
138
5
HOW TO REPLACE THE FLAT PACKAGE IC
142
5.1.
PREPARATION
142
5.2.
FLAT PACKAGE IC REMOVAL PROCEDURE
142
5.3.
FLAT PACKAGE IC INSTALLATION PROCEDURE 143
5.4.
BRIDGE MODIFICATION PROCEDURE
143
6
PRINTING OPERATION PRINCIPLE
144
6.1.
PROCESS CHART AND PROCESS BIAS
144
6.2.
CHARGING
144
6.3.
EXPOSING
145
6.4.
LASER SCANNING UNIT LOCATIONS
145
6.5.
DEVELOPING AND TRANSCRIPTION
146
6.6.
CLEANING
147
6.7.
FIXING
148
6.8.
TIMING CHART (When Printing Two Sheets of Paper)
149
6.9.
IMAGE READING
150
6.10. DOCUMENT TRANSMISSION
151
6.11. PRINTING
152
6.12. PAPER PICKUP
153
6.13. INITIALIZATION
154
6.14. Timing Chart [Initializing (Short)]
155
6.15. Timing Chart [Initializing (Long)]
155
6.16. Timing Chart (when the registration sensor is turned OFF
then ON during initializing)
156
7
CIRCUIT OPERATIONS
157
7.1.
CONNECTION DIAGRAM
157
7.2.
GENERAL BLOCK DIAGRAM
160
7.3.
FACSIMILE SECTION
162
7.4.
CIS CONTROL SECTION
188
7.5.
STEPPING MOTOR DRIVE SECTION
189
7.6.
FAN MOTOR SECTION
192
7.7.
SOLENOID DRIVE SECTION
194
7.8.
LSU (Laser Scanning Unit) SECTION
195
7.9.
SENSORS AND SWITCHES SECTION
197
7.10. OPERATION BOARD SECTION
204
7.11. LCD SECTION
205
7.12. HVPS (High Voltage Power Supply) SECTION
206
7.13. HEAT LAMP CONTROL CIRCUIT
209
7.14. POWER SUPPLY BOARD SECTION
213
8
TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES
216
8.1.
HOW TO REPLACE THE FLAT PACKAGE IC
218
9
FIXTURES AND TOOLS
220
CONTENTS
Page
Page
2
KX-FLM553RU
10 CABINET, MECHANICAL AND ELECTRICAL PARTS
LOCATION
221
10.1. GENERAL SECTON
221
10.2. OPERATION PANEL SECTION
222
10.3. CABINET/P.C.B. BLOCK
224
10.4. PICK UP BLOCK
225
10.5. CABINET BLOCK
226
10.6. FUSER BLOCK
227
10.7. MAIN FRAME BLOCK
228
10.8. MOTOR BLOCK
229
10.9. ACTUAL SIZE OF SCREWS AND WASHER
230
11 ACCESSORIES AND PACKING MATERIALS
231
12 REPLACEMENT PARTS LIST
232
12.1. CABINET AND ELECTRICAL PARTS
232
12.2. ACCESORIES AND PACKING MATERIALS
234
12.3. DIGITAL BOARD PARTS
234
12.4. ANALOG BOARD PARTS
237
12.5. OPERATION BOARD PARTS
240
12.6. HIGH VOLTAGE POWER SUPPLY BOARD PARTS 241
12.7. LOW VOLTAGE POWER SUPPLY BOARD PARTS 241
12.8. MOTOR DRIVE BOARD PARTS
242
12.9. SENSOR BOARD PARTS
243
12.10. VARISTOR BOARD PARTS
243
12.11. FIXTURES AND TOOLS
243
13 PRINTED CIRCUIT BOARD
245
13.1. DIGITAL BOARD (PCB1): COMPONENT VIEW
245
13.2. DIGITAL BOARD (PCB1): BOTTOM VIEW
246
13.3. ANALOG BOARD (PCB2): COMPONENT VIEW
247
13.4. ANALOG BOARD (PCB2): BOTTOM VIEW
248
13.5. OPERATION BOARD (PCB3): COMPONENT VIEW 249
13.6. OPERATION BOARD (PCB3): BOTTOM VIEW
250
13.7. HIGH VOLTAGE POWER SUPPLY BOARD (PCB4) 251
13.8. LOW VOLTAGE POWER SUPPLY BOARD (PCB5) 253
13.9. MOTOR DRIVE BOARD (PCB6) / SENSOR BOARD
(PCB7) / VARISTOR BOARD (PCB8)
254
14 FOR THE SCHEMATIC DIAGRAMS
255
15 SCHEMATIC DIAGRM
257
15.1. ANALOG BOARD (PCB2)
257
15.2. DIGITAL BOARD (PCB1)
259
15.3. OPERATION BOARD (PCB3)
263
15.4. HIGH VOLTAGE POWER SUPPLY BOARD (PCB4) 264
15.5. LOW VOLTAGE POWER SUPPLY BOARD (PCB5) 266
15.6. MOTOR DRIVE BOARD (PCB6)
267
15.7. SENSOR BOARD (PCB7)
267
15.8. VARISTOR BOARD (PCB8)
267
3
KX-FLM553RU
1 INTRODUCTION
1.1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
opposite side (See figure, below).
1.1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-FLM553RU
