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2 Precaution of Laser Diode
Caution :
This product utilizes a laser diode with the unit turned "ON", invisible laser radiation is emitted from the pick-up lens.
Wavelength : 785 nm(CD)/662 nm(DVD)
Maximum output radiation power from pick up : 100 µW/VDE
Wavelength : 785 nm(CD)/662 nm(DVD)
Maximum output radiation power from pick up : 100 µW/VDE
Laser radiation from pick up unit is safety level, but be sure the followings:
1. Do not disassemble the optical pick up unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pick up unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pick-up lens for a long time.
CAUTION!
THIS PRODUCT UTILIZES A LASER.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT
IN HAZARDOUS RADIATION EXPOSURE.
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Use of Caution Labels
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge to damage ES devices.
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SA-VK660EE
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