RR-XS400EE, RR-XS410EE - Panasonic Audio Service Manual (repair manual)

rr-xs400ee, rr-xs410ee service manual
Model
RR-XS400EE RR-XS410EE
Pages
28
Size
2.82 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio / IC RECORDER
File
rr-xs400ee-rr-xs410ee.pdf
Date

Read Panasonic RR-XS400EE / RR-XS410EE Service Manual online

ORDER NO. AD1108011CE
IC Recorder
Model No.
RR-XS400EE
RR-XS410EE
Colour
(S)...........Silver Type (only RR-XS400)
(W)..........White Type (only RR-XS410)
2
TABLE OF CONTENTS
PAGE
PAGE
1 Warning -------------------------------------------------------------- 3
1.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 3
2 Service Navigation ----------------------------------------------- 4
2.1. Introduction-------------------------------------------------- 4
2.2. General Description About Lead Free Solder
(PbF)---------------------------------------------------------- 4
3 Specifications ----------------------------------------------------- 5
4 Location of Controls and Components ------------------- 6
5 Service Fixture & Tools----------------------------------------- 7
5.1. Service Position-------------------------------------------- 7
6 Disassembly and Assembly Instructions ---------------- 8
6.1. Removal of the Front Cabinet Ass’y ------------------ 8
6.2. Removal of the Operation P.C.B. Ass’y -------------- 8
6.3. Removal of the USB Terminal Ass’y ------------------ 9
6.4. Removal of the Rear Cabinet Ass’y------------------- 9
6.5. Removal of the Middle Frame Ass’y and USB
Cover Ass’y ------------------------------------------------10
6.6. Removal of the LCD Ass’y ----------------------------- 11
7 Schematic Diagram ---------------------------------------------12
7.1. Interconnection Diagram--------------------------------12
7.2. Main Schematic Diagram-------------------------------13
7.3. Operation Schematic Diagram ------------------------14
7.4. Switch Schematic Diagram ----------------------------15
7.5. USB Schematic Diagram -------------------------------15
8 Printed Circuit Board-------------------------------------------16
8.1. Main P.C.B./Switch P.C.B.------------------------------16
8.2. Operation P.C.B./USB P.C.B.--------------------------18
9 Exploded View and Replacement Parts List -----------20
9.1. Casing Parts Section (RR-XS400EE/
XS410EE) --------------------------------------------------20
9.2. Packing & Accessories Section (RR-
XS400EE/XS410EE) ------------------------------------21
9.3. Replacement Parts List ---------------------------------22
3
1 Warning
1.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically 
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
4
2 Service Navigation
2.1.
Introduction
This service manual contains technical information, which allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, the information will be followed by service manual to be controlled with original service manual.
2.2.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
°C (86°F) more than that of the
normal solder.
Distinction of P.C.B. Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the P.C.B. using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
°C
(662±86
°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
Page of 28
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Download Panasonic RR-XS400EE / RR-XS410EE Service Manual (Repair Manual)

Here you can read online and download Panasonic RR-XS400EE / RR-XS410EE Service Manual in PDF. RR-XS400EE / RR-XS410EE service manual will guide through the process and help you recover, restore, fix, disassemble and repair Panasonic RR-XS400EE / RR-XS410EE Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.