Read Sony MEX-BT2600 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
MEX-BT2600
SPECIFICATIONS
Bluetooth™ AUDIO SYSTEM
9-887-908-01
2007K05-1
©
2007.11
US Model
Canadian Model
AEP Model
UK Model
E Model
Ver. 1.0 2007.11
Model Name Using Similar Mechanism
CDX-GT220/GT370/
GT370S
GT370S
Mechanism Type
MG-101TC-188//Q
Optical Pick-up Name
DAX-25A
The “HD Radio Ready” logo indicates that this
product will control a Sony HD Radio
product will control a Sony HD Radio
TM
tuner
(sold separately).
For HD Radio
For HD Radio
TM
tuner operation, please refer to
the HD Radio
TM
tuner Operating Instructions.
The HD Radio Ready logo is a registered
trademark of iBiquity.
trademark of iBiquity.
HD Radio
TM
is a trademark of iBiquity Digital
Corp.
The Bluetooth word mark and logos are owned
by the Bluetooth SIG, Inc. and any use of such
marks by Sony Corporation is under license.
Other trademarks and trade names are those of
their respective owners.
The “SAT Radio Ready”
logo indicates that this
product will control a satellite
radio tuner module (sold
separately). Please see your nearest authorized
Sony dealer for details on the satellite radio
tuner module.
“SAT Radio,” “SAT Radio Ready,” the SAT
Radio and SAT Radio Ready logos and all
related marks are trademarks of Sirius Satellite
Radio Inc. and XM Satellite Radio Inc.
Microsoft, Windows Media,
and the Windows logo are
trademarks or registered
trademarks of Microsoft
Corporation in the United States and/or other
countries.
CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Tuner section
FM
Tuning range: 87.5 – 107.9 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
AM
Tuning range: 530 – 1,710 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
AUDIO POWER SPECIFICATIONS
(US model only)
(US model only)
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION
23.2 watts per channel minimum continuous
average power into 4 ohms, 4 channels driven
from 20 Hz to 20 kHz with no more than 5% total
harmonic distortion.
CEA2006 Standard
Power Output: 17 Watts RMS
× 4 at
4 Ohms < 1% THD+N
SN Ratio: 82 dBA
(reference: 1 Watt into 4 Ohms)
FM
(AEP, Russian and UK models)
(US and Canadian models)
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
MW/LW
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: MW: 30 μV, LW: 40 μV
FM
(E and Indian models)
Tuning range:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
FM tuning interval: 50 kHz/200 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
– Continued on next page –
MEX-BT2600
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Wireless Communication
Communication System:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2 (Max. +4 dBm)
Maximum communication range:
Line of sight approx. 10 m (33 ft)*
1
Frequency band:
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
Compatible Bluetooth Profiles*
2
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile) 1.5
HSP (Headset Profile)
*1 The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
*2 Bluetooth standard profiles indicate the purpose of
Bluetooth communication between devices.
Power amplifier section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W
× 4 (at 4 ohms)
General
Output:
Audio outputs terminal (front, sub/rear switchable)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Inputs:
Telephone ATT control terminal
BUS control input terminal
BUS audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
Tone controls:
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178
× 50 × 179 mm
(7
1
/
8
× 2 × 7
1
/
8
in) (w/h/d)
Mounting dimensions: Approx. 182
× 53 × 162 mm
(7
1
/
4
× 2
1
/
8
× 6
1
/
2
in) (w/h/d)
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories:
Card remote commander: RM-X304
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
without notice.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
MW
Tuning range:
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
MW tuning interval: 9 kHz/10 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 μV
SW
Tuning range:
SW1: 2,940 – 7,735 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 μV
FM
(Saudi Arabia model)
Tuning range: 87.5 – 108.0 MHz (at 50 kHz step)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
MW
Tuning range: 531 – 1,602 kHz (at 9 kHz step)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 μV
SW
Tuning range:
SW1: 2,940 – 7,735 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 μV
• US and Canadian models:
CAUTION
The use of optical instruments with this
product will increase eye hazard.
CAUTION
The use of optical instruments with this
product will increase eye hazard.
This product is classified as a CLASS
• Except US and Canadian models:
1 LASER PRODUCT.
This label is located on the bottom of the
This label is located on the bottom of the
chassis.
MEX-BT2600
3
1.
SERVICING NOTES
............................................. 4
2. GENERAL
.................................................................. 7
3. DISASSEMBLY
3-1. Disassembly Flow .......................................................... 14
3-2. Cover ............................................................................... 14
3-3. CD Mechanism Deck Block (MG-101TC-188//Q) ........ 15
3-4. ANTENNA Board .......................................................... 15
3-5. MAIN Board ................................................................... 16
3-6. SERVO Board ................................................................. 16
3-7. Chassis (T) Sub Assy ..................................................... 17
3-8. Roller Arm Assy .............................................................. 17
3-9. Chassis (OP) Assy .......................................................... 18
3-10. Chucking Arm Sub Assy ................................................. 18
3-11. Sled Motor Assy ............................................................. 19
3-12. Optical Pick-Up Section ................................................. 20
3-13. OP Service Assy (DAX-25A) ........................................ 20
3-2. Cover ............................................................................... 14
3-3. CD Mechanism Deck Block (MG-101TC-188//Q) ........ 15
3-4. ANTENNA Board .......................................................... 15
3-5. MAIN Board ................................................................... 16
3-6. SERVO Board ................................................................. 16
3-7. Chassis (T) Sub Assy ..................................................... 17
3-8. Roller Arm Assy .............................................................. 17
3-9. Chassis (OP) Assy .......................................................... 18
3-10. Chucking Arm Sub Assy ................................................. 18
3-11. Sled Motor Assy ............................................................. 19
3-12. Optical Pick-Up Section ................................................. 20
3-13. OP Service Assy (DAX-25A) ........................................ 20
4.
TEST MODE
............................................................ 21
5. DIAGRAMS
5-1. Printed Wiring Boards - MAIN Section - ....................... 24
5-2. Schematic Diagram - MAIN Section (1/3) - ................... 25
5-3. Schematic Diagram - MAIN Section (2/3) - ................... 26
5-4. Schematic Diagram - MAIN Section (3/3) - ................... 27
5-5. Printed Wiring Board - KEY Board -.............................. 28
5-6. Schematic Diagram - KEY Board - ................................ 29
5-2. Schematic Diagram - MAIN Section (1/3) - ................... 25
5-3. Schematic Diagram - MAIN Section (2/3) - ................... 26
5-4. Schematic Diagram - MAIN Section (3/3) - ................... 27
5-5. Printed Wiring Board - KEY Board -.............................. 28
5-6. Schematic Diagram - KEY Board - ................................ 29
6.
EXPLODED VIEWS
6-1. Main
Section
................................................................... 33
6-2. Front Panel Section ......................................................... 34
6-3. CD Mechanism Deck Section (MG-101TC-188//Q) ...... 35
6-3. CD Mechanism Deck Section (MG-101TC-188//Q) ...... 35
7.
ELECTRICAL PARTS LIST
.............................. 36
TABLE OF CONTENTS
MEX-BT2600
4
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your
sight.
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your
sight.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
TEST DISCS
Use following TEST DISC when this set confi rms the operation
and checks it.
Use following TEST DISC when this set confi rms the operation
and checks it.
3-702-101-01
YEDS-18 (for CD)
4-225-203-01
PATD-012 (for CD)
J-2502-063-1
TCD-R082LMT (for CD-R)
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
• Connect the MAIN board (CN350) and the SERVO board
(CN2) with the extension cable (Part No. J-2502-076-1).
SECTION 1
SERVICING NOTES
optical pick-up
semi-fixed resistor
SERVO BOARD
(CN2)
(CN2)
MAIN BOARD
(CN350)
(CN350)
J-2502-076-1