Read Sony CDX-GT250MP / CDX-GT252MP Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
CDX-GT250MP/GT252MP
SPECIFICATIONS
FM/MW/LW COMPACT DISC PLAYER
9-893-039-02
2012G33-1
©
2012.07
AEP Model
UK Model
Ver. 1.1 2012.07
Model Name Using Similar Mechanism
CDX-GT300EB
CD Drive Mechanism Type
MG-101X-188
Optical Pick-up Name
DAX-25A
Photo: CDX-GT250MP
• The tuner and CD sections have no adjustments.
Tuner section
FM
Tuning range:
87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 150 kHz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
FM
Tuning range:
87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 150 kHz
Usable sensitivity: 10 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 70 dB (mono)
Separation: 40 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
MW/LW
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Sensitivity: MW: 26
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Sensitivity: MW: 26
V, LW: 45 V
CD player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and fl utter: Below measurable limit
Power amplifi er section
Output: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 45 W
Output: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 45 W
4 (at 4 ohms)
General
Outputs:
Outputs:
Audio outputs terminal (sub/rear switchable)
Power antenna (aerial) relay control terminal
Power
amplifi er control terminal
Inputs:
Telephone ATT control terminal
Remote controller input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
Tone controls:
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground (earth))
– Continued on next page –
CDX-GT250MP/GT252MP
2
Dimensions: Approx. 178
× 50 × 179 mm
(7
1
/
8
× 2 × 7
1
/
8
in.) (w/h/d)
Mounting dimensions:
Approx.
Approx.
182
× 53 × 162 mm
(7
1
/
4
× 2
1
/
8
× 6
1
/
2
in.) (w/h/d)
Mass: Approx. 1.2 kg (2 lb. 11 oz.)
Supplied accessory:
Parts for installation and connections (1 set)
Supplied accessory:
Parts for installation and connections (1 set)
Design and specifi cations are subject to change
without notice.
without notice.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
TEST DISCS
Please use the following test discs for the check on the CD
section.
Please use the following test discs for the check on the CD
section.
YEDS-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up
semi-fixed resistor
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CDX-GT250MP/GT252MP
3
This compact disc player is classifi ed as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
This label is located on the bottom of the chassis.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
1.
SERVICE NOTE
...................................................... 4
2. GENERAL
Connections
....................................................................
5
3. DISASSEMBLY
3-1. Sub Panel Assy ............................................................... 7
3-2. CD Mechanism Block ..................................................... 7
3-3. Main Board ..................................................................... 8
3-4. Servo
3-2. CD Mechanism Block ..................................................... 7
3-3. Main Board ..................................................................... 8
3-4. Servo
Board
.................................................................... 8
3-5. Chassis (T) Sub Assy ...................................................... 9
3-6. Roller
3-6. Roller
Arm
Assy
.............................................................. 9
3-7. Chassis
(OP)
Assy
........................................................... 10
3-8. Chucking
Arm
Sub
Assy
................................................. 10
3-9. Sled
Motor
Assy
.............................................................. 11
3-10. Optical Pick-up Section .................................................. 12
3-11. Optical Pick-up ............................................................... 12
3-11. Optical Pick-up ............................................................... 12
4. DIAGRAMS
4-1. Block Diagram –Main Section– ..................................... 13
4-2. Block Diagram –Display Section– ................................. 14
4-3. Printed Wiring Board –Main Section– ............................ 16
4-4. Schematic Diagram –Main Section (1/3)– ...................... 17
4-5. Schematic Diagram –Main Section (2/3)– ...................... 18
4-6. Schematic Diagram –Main Section (3/3)– ...................... 19
4-7. Printed Wiring Board –Key Section– ............................. 20
4-8. Schematic Diagram –Key Section– ................................ 21
4-2. Block Diagram –Display Section– ................................. 14
4-3. Printed Wiring Board –Main Section– ............................ 16
4-4. Schematic Diagram –Main Section (1/3)– ...................... 17
4-5. Schematic Diagram –Main Section (2/3)– ...................... 18
4-6. Schematic Diagram –Main Section (3/3)– ...................... 19
4-7. Printed Wiring Board –Key Section– ............................. 20
4-8. Schematic Diagram –Key Section– ................................ 21
5. EXPLODED
VIEWS
5-1. Main
Section
................................................................... 26
5-2. Front Panel Section ......................................................... 27
5-3. CD Mechanism Section (MG-101X-188) ....................... 28
5-3. CD Mechanism Section (MG-101X-188) ....................... 28
6.
ELECTRICAL PARTS LIST
.................................. 29
TABLE OF CONTENTS
CDX-GT250MP/GT252MP
4
SECTION 1
SERVICE NOTE
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
When repairing or servicing this set, connect the jig (extension
cable) as shown below.
• Connect the MAIN board (CN701) and the SERVO board
(CN401) with the extension cable (Part No. J-2502-076-1).
NOTE FOR REPLACEMENT OF THE SERVO BOARD
When repairing, the complete SERVO board (Part No.
A-1768-003-A) should be replaced since any parts in the SERVO
board cannot be repaired.
When repairing, the complete SERVO board (Part No.
A-1768-003-A) should be replaced since any parts in the SERVO
board cannot be repaired.
NOTE FOR REPLACEMENT OF THE AUX JACK (J901)
To replace the AUX jack requires alignment.
1. Insert the AUX jack into the KEY board.
2. Place the KEY board on the front panel.
3. Solder the three terminals of the jack.
To replace the AUX jack requires alignment.
1. Insert the AUX jack into the KEY board.
2. Place the KEY board on the front panel.
3. Solder the three terminals of the jack.
NOTE FOR THE 15-PIN CONNECTOR (CN001)
Do not use alcohol to clean the 15-pin connector (CN001) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
Do not use alcohol to clean the 15-pin connector (CN001) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
SERVO BOARD
CN401
CN401
MAIN BOARD
CN701
CN701
J-2502-076-1
KEY board
AUX jack
front panel