Read Sony ICD-SX750 / ICD-SX750D / ICD-SX850 / ICD-SX850D / ICD-SX950 Service Manual online
SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
ICD-SX750/SX750D/SX850/
SX850D/SX950
SPECIFICATIONS
IC RECORDER
9-889-622-02
2010A04-1
©
2010.01
US Model
Canadian Model
ICD-SX750/SX750D
AEP Model
E Model
ICD-SX750/SX850/SX850D
Chinese Model
Korea Model
ICD-SX750/SX850/SX950
Latin American Model
ICD-SX750
Taiwan Model
ICD-SX950
Ver. 1.1 2010.01
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus affected unit was found during
service, contact your Service Headquarters.
IC recorder section
Capacity (User available capacity)
ICD-SX750/SX750D: 2 GB
(approx. 1.9GB = 2,047,737,856 Byte)
ICD-SX850/SX850D: 4 GB
(approx. 3.82 GB = 4,108,156,928 Byte)
ICD-SX950: 8 GB
(approx. 7.66 GB = 8,234,827,776 Byte)
A part of the memory capacity is used as a
management area.
ICD-SX750/SX750D: 2 GB
(approx. 1.9GB = 2,047,737,856 Byte)
ICD-SX850/SX850D: 4 GB
(approx. 3.82 GB = 4,108,156,928 Byte)
ICD-SX950: 8 GB
(approx. 7.66 GB = 8,234,827,776 Byte)
A part of the memory capacity is used as a
management area.
Recording time
Maximum recording time
When all messages are recorded with
the same recording mode, the maximum
recording time of all the folders is as
follows.
When all messages are recorded with
the same recording mode, the maximum
recording time of all the folders is as
follows.
ICD-SX750/SX750D
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
3 hr. 10 min.
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
3 hr. 10 min.
6 hr. 25 min.
23 hr. 35 min.
MP3 128k mode
MP3 48k mode
LPEC STHQ mode
35 hr. 25 min.
94 hr. 40 min.
34 hr. 55 min.
LPEC ST mode
LPEC STLP mode LPEC SP mode
92 hr. 15 min.
177 hr. 40 min.
281 hr. 20 min.
LPEC LP mode
750 hr. 15 min.
750 hr. 15 min.
ICD-SX850/SX850D
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
6 hr. 25 min.
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
6 hr. 25 min.
12 hr. 50 min.
47 hr. 30 min.
MP3 128k mode
MP3 48k mode
LPEC STHQ mode
71 hr. 15 min.
190 hr. 5 min.
70 hr. 10 min.
LPEC ST mode
LPEC STLP mode LPEC SP mode
185 hr. 20 min.
356 hr. 45 min.
564 hr. 40 min.
LPEC LP mode
1,505 hr. 55 min.
1,505 hr. 55 min.
Photo: ICD-SX750
ICD-SX950
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
12 hr. 55 min.
LPCM 44/16 mode LPCM 22/16 mode MP3 192k mode
12 hr. 55 min.
25 hr. 50 min.
95 hr. 15 min.
MP3 128k mode
MP3 48k mode
LPEC STHQ mode
142 hr. 50 min.
381 hr. 5 min.
140 hr. 45 min.
LPEC ST mode
LPEC STLP mode LPEC SP mode
371 hr. 35 min.
715 hr. 20 min.
1,132 hr. 15 min.
LPEC LP mode
3,019 hr. 25 min.
3,019 hr. 25 min.
(hr. : hours/min. : minutes)
Frequency range
• LPCM 44/16: 50 - 20,000 Hz
• LPCM 22/16: 50 - 10,000 Hz
• MP3 192k: 50 - 16,000 Hz
• MP3 128 k: 50 - 16,000 Hz
• MP3 48 k: 50 - 14,000 Hz
• LPEC STHQ: 50 - 20,000 Hz
• LPEC ST: 50 - 16,500 Hz
• LPEC STLP: 50 - 7,000 Hz
• LPEC SP: 50 - 6,000 Hz
• LPEC LP: 50 - 3,500 Hz
• LPCM 44/16: 50 - 20,000 Hz
• LPCM 22/16: 50 - 10,000 Hz
• MP3 192k: 50 - 16,000 Hz
• MP3 128 k: 50 - 16,000 Hz
• MP3 48 k: 50 - 14,000 Hz
• LPEC STHQ: 50 - 20,000 Hz
• LPEC ST: 50 - 16,500 Hz
• LPEC STLP: 50 - 7,000 Hz
• LPEC SP: 50 - 6,000 Hz
• LPEC LP: 50 - 3,500 Hz
Bit rates and sampling frequencies for
MP3 fi les*
MP3 fi les*
2
Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz
*
2
The playback of MP3 fi les recorded using
the IC recorder is also supported.
Not all encoders are supported.
Bit rate and sampling frequencies*
3
for
WMA fi les
Bit rate: 32 - 192 kbps, VBR
Sampling frequencies: 44.1 kHz
Bit rate: 32 - 192 kbps, VBR
Sampling frequencies: 44.1 kHz
*
3
WMA Ver. 9 is compatible, however, MBR
(Multi Bit Rate), Lossless, Professional, and
Voice are not supported.
A
fi le of which copyright is protected cannot
be played back.
Not all encoders are supported.
General
Speaker
Approx. 16 mm dia.
Approx. 16 mm dia.
Power output
150 mW
150 mW
Input/Output
• Microphone jack (minijack, stereo)
– input for plug in power, minimum input
level 0.9 mV, 3 kilohms or lower impedance
microphone
• Headphone jack (minijack, stereo)
– output for 8 - 300 ohms headphones
• USB connector
– High-Speed USB compatible
• Microphone jack (minijack, stereo)
– input for plug in power, minimum input
level 0.9 mV, 3 kilohms or lower impedance
microphone
• Headphone jack (minijack, stereo)
– output for 8 - 300 ohms headphones
• USB connector
– High-Speed USB compatible
Playback speed control (DPC)
–75% to +200%
–75% to +200%
– Continued on next page –
ICD-SX750/SX750D/SX850/SX850D/SX950
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Power requirements
Two LR03 (size AAA) alkaline batteries (not supplied): 3.0 V DC
Two NH-AAA rechargeable batteries (supplied): 2.4 V DC
Two LR03 (size AAA) alkaline batteries (not supplied): 3.0 V DC
Two NH-AAA rechargeable batteries (supplied): 2.4 V DC
Operating temperature
5 ˚C - 35 ˚C
5 ˚C - 35 ˚C
Dimensions (w/h/d) (not incl.
projecting parts and controls) (JEITA)*
projecting parts and controls) (JEITA)*
4
31.3
× 130.0 × 15.4 mm
Mass (JEITA)*
4
Approx. 77 g including NH-AAA rechargeable batteries
*
4
Measured value by the standard of JEITA
(Japan Electronics and Information
Technology
Technology
Industries
Association)
Supplied accessories
IC Recorder (1)
Remove
IC Recorder (1)
Remove
the
fi lm on the display window
before you use the IC recorder.
LR03 (size AAA) alkaline batteries (2) or
NH-AAA (size AAA) rechargeable batteries (2)
Stereo headphones* (1) (Except AEP model)
Wind Screen (1)
Use this to cover the built-in microphones.
USB connecting cable (1)
Application Software, Digital Voice Editor (CD-ROM)
Application Software, Sound Forge Audio Studio LE (CD-ROM)*
(SX750: US, Canadian model/SX850: AEP model)
Application Software, Dragon Naturally Speaking (DVD-ROM)*
(SX750D/SX850D)
Cradle* (1) (SX750D/SX850D)
Stand (1)
Carrying pouch (1)
Telephone recording microphone* (1) (E, Chinese, Korea, Taiwan model)
Battery case* (Except SX750: US, Canadian, Latin American model)
Operating Instructions
LR03 (size AAA) alkaline batteries (2) or
NH-AAA (size AAA) rechargeable batteries (2)
Stereo headphones* (1) (Except AEP model)
Wind Screen (1)
Use this to cover the built-in microphones.
USB connecting cable (1)
Application Software, Digital Voice Editor (CD-ROM)
Application Software, Sound Forge Audio Studio LE (CD-ROM)*
(SX750: US, Canadian model/SX850: AEP model)
Application Software, Dragon Naturally Speaking (DVD-ROM)*
(SX750D/SX850D)
Cradle* (1) (SX750D/SX850D)
Stand (1)
Carrying pouch (1)
Telephone recording microphone* (1) (E, Chinese, Korea, Taiwan model)
Battery case* (Except SX750: US, Canadian, Latin American model)
Operating Instructions
* The stereo headphones, the cradle , the battery case and
the microphone, and some of the software are supplied with some models
in some regions only.
in some regions only.
Design and specifi cations are subject to change without notice.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Ver. 1.1
ICD-SX750/SX750D/SX850/SX850D/SX950
3
1. DISASSEMBLY
1-1. Speaker Assy (SP001) ..................................................... 5
1-2. Battery Case Lid Assy ..................................................... 5
1-3. Case Assy ........................................................................ 6
1-4. Audio Board Section, Chassis Section, Switch Board .... 6
1-5. Main
1-2. Battery Case Lid Assy ..................................................... 5
1-3. Case Assy ........................................................................ 6
1-4. Audio Board Section, Chassis Section, Switch Board .... 6
1-5. Main
Board
..................................................................... 7
1-6. Liquid Crystal Display Panel (LCD101) ........................ 7
1-7. Audio
1-7. Audio
Board
.................................................................... 8
1-8. Jack
Board
....................................................................... 8
1-9. Microphone Cap, Microphone Holder ............................ 9
1-10. MIC101, MIC102, MIC103 ............................................ 9
1-10. MIC101, MIC102, MIC103 ............................................ 9
2.
TEST MODE
............................................................ 10
3. DIAGRAMS
3-1. Block Diagram –Main1 Section– ................................... 13
3-2. Block Diagram –Main2 Section– ................................... 14
3-3. Printed Wiring Board –Audio Section (1/2)– ................. 16
3-4. Printed Wiring Board –Audio Section (2/2)– ................. 17
3-5. Schematic Diagram –Audio Section (1/2)– .................... 18
3-6. Schematic Diagram –Audio Section (2/2)– .................... 19
3-7. Printed Wiring Board –Main Section (1/2)– ................... 20
3-8. Printed Wiring Board –Main Section (2/2)– ................... 21
3-9. Schematic Diagram –Main Section (1/5)– ...................... 22
3-10. Schematic Diagram –Main Section (2/5)– ...................... 23
3-11. Schematic Diagram –Main Section (3/5)– ...................... 24
3-12. Schematic Diagram –Main Section (4/5)– ...................... 25
3-13. Schematic Diagram –Main Section (5/5)– ...................... 26
3-14. Printed Wiring Boards –Function Section– .................... 27
3-15. Schematic Diagram –Function Section– ......................... 28
3-2. Block Diagram –Main2 Section– ................................... 14
3-3. Printed Wiring Board –Audio Section (1/2)– ................. 16
3-4. Printed Wiring Board –Audio Section (2/2)– ................. 17
3-5. Schematic Diagram –Audio Section (1/2)– .................... 18
3-6. Schematic Diagram –Audio Section (2/2)– .................... 19
3-7. Printed Wiring Board –Main Section (1/2)– ................... 20
3-8. Printed Wiring Board –Main Section (2/2)– ................... 21
3-9. Schematic Diagram –Main Section (1/5)– ...................... 22
3-10. Schematic Diagram –Main Section (2/5)– ...................... 23
3-11. Schematic Diagram –Main Section (3/5)– ...................... 24
3-12. Schematic Diagram –Main Section (4/5)– ...................... 25
3-13. Schematic Diagram –Main Section (5/5)– ...................... 26
3-14. Printed Wiring Boards –Function Section– .................... 27
3-15. Schematic Diagram –Function Section– ......................... 28
4.
EXPLODED VIEWS
4-1. Case
Section
.................................................................... 41
4-2. Chassis
Section
............................................................... 42
4-3. Microphone
Section
........................................................ 43
5.
ELECTRICAL PARTS LIST
.............................. 44
TABLE OF CONTENTS
ICD-SX750/SX750D/SX850/SX850D/SX950
4
SECTION 1
DISASSEMBLY
• This set can be disassembled in the order shown below.
1-1. SPEAKER
ASSY
(SP001)
(Page 5)
SET
1-2. BATTERY CASE LID ASSY
(Page
(Page
5)
1-3. CASE
ASSY
(Page
6)
1-7. AUDIO
BOARD
(Page
8)
1-8. JACK
BOARD
(Page
8)
1-9. MICROPHONE
CAP,
MICROPHONE
HOLDER
(Page
9)
1-10. MIC101, MIC102, MIC103
(Page
(Page
9)
1-4. AUDIO BOARD SECTION,
CHASSIS
CHASSIS
SECTION,
SWITCH
BOARD
(Page
6)
1-5. MAIN BOARD
(Page
(Page
7)
1-6. LIQUID CRYSTAL DISPLAY PANE (LCD101)
(Page
(Page
7)