HCD-SH2000 - Sony Audio Service Manual (repair manual)

2013F08-1

© 

2013.06

•  HCD-SH2000 is the tuner, USB, CD
 and 

amplifi er section in FST-SH2000/LBT-SH2000.

•  “WALKMAN” and “WALKMAN” logo are registered trademarks of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and 

Thomson.

•  Windows Media is either a registered trademark or trademark of Microsoft Corporation in 

the United States and/or other countries.

•  This product contains technology subject to certain intellectual property rights of Microsoft. 

Use or distribution of this technology outside of this product is prohibited without the ap-
propriate license(s) from Microsoft.

Amplifi er section
The following are measured at AC 120 V -
240 V, 50/60 Hz
Power output (rated):
   High 

channel

   

300 W + 300 W (at 4 

Ω

, 1 kHz,

   1% 

THD) 

   Low 

channel

   

300 W + 300 W (at 4 Ω, 100 Hz,

   1% 

THD)

RMS output power (reference):
   High 

channel

   

500 W + 500 W (per channel at 

   4 

Ω, 1 kHz) 

   Low 

channel

   

500 W + 500 W (per channel at 

   4 

Ω, 100 Hz)

Inputs
PC (AUDIO IN) L/R, TV (AUDIO IN) L/R,
DVD/SAT (AUDIO IN) L/R, GAME
(AUDIO IN) L/R
   

Voltage 2 V, impedance 47 kΩ

MIC
   

Sensitivity 1 mV, impedance 10 kΩ

 A, 

 B port: Type A

USB section
Supported bit rate
   

MP3 (MPEG 1 Audio Layer-3):

   

32 kbps – 320 kbps, VBR

   

WMA: 48 kbps – 192 kbps

   

AAC: 48 kbps – 320 kbps

Sampling frequencies
   

MP3 (MPEG 1 Audio Layer-3):

   

32 kHz/44.1 kHz/48 kHz

   

WMA: 44.1 kHz

   

AAC: 44.1 kHz

Transfer speed
   Full-Speed
Supported USB device
   

Mass Storage Class

Maximum current
   500 

mA

Disc player section
System
   

Compact disc and digital audio system

Laser Diode Properties
   

Emission Duration: Continuous

   

Laser Output*: Less than 44.6 μW

   

* This output is the value measurement

   

  at a distance of 200 mm from the

   

  objective lens surface on the Optical

   

  Pick-up Block with 7 mm aperture.

Frequency response
   

20 Hz – 20 kHz

Signal-to-noise ratio
   

More than 90 dB

Dynamic range
   

More than 88 dB

Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
   

FM lead antenna

   

AM loop antenna

FM tuner section
Tuning range
   

87.5 MHz – 108.0 MHz (50 kHz step)

AM tuner section
Tuning range
   

US, E2, E51 and MX models:

   

530 kHz – 1,710 kHz (10 kHz step)

   

531 kHz – 1,710 kHz (9 kHz step)

   EA 

model:

   

531 kHz – 1,602 kHz (9 kHz step)

   

MY and SAF models: 

   

530 kHz – 1,610 kHz (10 kHz step)

   

531 kHz – 1,602 kHz (9 kHz step)

General
Power requirements
   

AC 120 V – 240 V, 50/60 Hz

Power consumption
   320 

W

Dimensions (w/h/d) (excl. speakers)
(Approx.)
   

510 mm × 235 mm × 420 mm

Mass (excl. speakers) (Approx.)
   10.0 

kg

Supplied accessories
   

Remote control (1)

   

R6 (Size AA) batteries (2)

   

FM lead/AM loop antenna (1)

   

Speaker foot (8)

Design and specifi cations are subject to
change without notice.

• Abbreviation
  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

  EA 

: Saudi Arabia model

  MX 

: Mexican model

  MY 

: Malaysia model

  SAF 

: South African model

CD 
Section

CD Mechanism 
Type

CDM86B-DVBU101

Optical Pick-up
Name

KHM-313CAB/C2NP

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

SAFETY  CHECK-OUT
After correcting the original service problem, perform the following 
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage. Check 
leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA
 

WT-540A. Follow the manufacturers’ instructions to use these

 instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245
 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a
 

VOM or battery-operated AC voltmeter. The “limit” indication

 

is 0.75 V, so analog meters must have an accurate low-voltage

 

scale. The Simpson 250 and Sanwa SH-63Trd are examples

 

of a passive VOM that is suitable. Nearly all battery operated

 

digital multimeters that have a 2V AC range are suitable. (See

 Fig. 

A)

  .............................................   4

2-1.   Side Panel A, Side Panel B and Top Panel Section ........   6
2-2.   Back Panel Section .........................................................   7
2-3.   Front Panel Section  ........................................................   7
2-4.   DMB21 Board .................................................................   8
2-5.   CDM Section ..................................................................   8
2-6.   CD MECHANISM DECK BLOCK (1) .........................   9
2-7.   CD MECHANISM DECK BLOCK (2) .........................   9
2-8.   DAMP Board, MAIN Board ...........................................   10
2-9.   SWITCHING REGULATOR .........................................   10

TEST  MODE 

 ............................................................   11

ELECTRICAL  CHECK 

 .........................................   13

5-1.  Block Diagram - RS SERVO, USB Section - .................   15
5-2.  Block Diagram - MAIN Section - ...................................   16
5-3.  Block Diagram - AMP Section - .....................................   17
5-4.  Block Diagram - PANEL, POWER SUPPLY Section - .   18
5-5.  Printed Wiring Board  
 

- MAIN Board (Component Side) (Suffi x 11) - ..............   20

5-6.  Printed Wiring Board  
 

- MAIN Board (Conductor Side) (Suffi x 11) - ...............   21

5-7.  Printed Wiring Board  
 

- MAIN Board (Component Side) (Suffi x 12) - .............   22

5-8.  Printed Wiring Board  
 

- MAIN Board (Conductor Side) (Suffi x 12) - ...............   23

5-9.  Schematic Diagram - MAIN Board (1/4) (Suffi x 11) - ...   24
5-10.  Schematic Diagram - MAIN Board (2/4) (Suffi x 11) - ...   25
5-11.  Schematic Diagram - MAIN Board (3/4) (Suffi x 11) - ...   26
5-12.  Schematic Diagram - MAIN Board (4/4) (Suffi x 11) - ...   27
5-13.  Schematic Diagram - MAIN Board (1/4) (Suffi x 12) - ..   28
5-14.  Schematic Diagram - MAIN Board (2/4) (Suffi x 12) - ..   29
5-15.  Schematic Diagram - MAIN Board (3/4) (Suffi x 12) - ..   30
5-16.  Schematic Diagram - MAIN Board (4/4) (Suffi x 12) - ..   31
5-17. Printed Wiring Board 
 

- DMB21  Board (Component Side) - ............................   32

5-18. Printed Wiring Board 
 

- DMB21 Board (Conductor Side) - ...............................   33

5-19.  Schematic Diagram - DMB21 Board (1/3) - ..................   34
5-20.  Schematic Diagram - DMB21 Board (2/3) - ..................   35
5-21.  Schematic Diagram - DMB21 Board (3/3) - ..................   36
5-22. Printed Wiring Boards 
 

- DAMP Board (Component Side) - ...............................   37

5-23. Printed Wiring Boards 
 

- DAMP Board (Conductor Side) - .................................   38

5-24.  Schematic Diagram - DAMP Board (1/4) - ....................   39
5-25.  Schematic Diagram - DAMP Board (2/4) - ....................   40
5-26.  Schematic Diagram - DAMP Board (3/4) - ....................   41
5-27.  Schematic Diagram - DAMP Board (4/4) - ....................   42
5-28.  Printed Wiring Boards -

DISPLAY Board - ...................   43

5-29.  Schematic Diagram -

DISPLAY Board - ........................   44

5-30.  Printed Wiring Boards - VOLUME Board- ....................   45
5-31.  Schematic Diagram - VOLUME Board - .......................   46
5-32.  Printed Wiring Boards -

BUTTON, USB Board - ..........   47

5-33.  Schematic Diagram -

BUTTON, USB Board - ..............   48

5-34.  Printed Wiring Boards -

VOLUME LED, 

 

BOTTON LED AND TUNER Board - ...........................   49

5-35.  Schematic Diagram -

VOLUME LED, 

 

BOTTON LED AND TUNER Board - ...........................   50

5-36.  Printed Wiring Boards -

AUDIO-IN Board - .................   51

5-37.  Schematic Diagram -

AUDIO-IN Board - ......................   51

5-38.  Printed Wiring Boards -

MIC Board - ............................   52

5-39.  Schematic Diagram -

MIC Board - .................................   52

6-1. Main 

Section 

...................................................................  65

6-2.  Front Panel Section (1) ...................................................   66
6-3.  Back Panel Section .........................................................   67
6-4. Chassis 

Section 

...............................................................  68

6-5. CDM 

Section 

..................................................................  69

  ..............................   70

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be
 

damaged by heat.

Flexible Circuit Board Repairing
•  Keep the temperature of the soldering iron around 270 °C
 during 

repairing.

•  Do not touch the soldering iron on the same conductor of the
 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering
 or 

unsoldering.

UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the 
leadfree mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with
 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher
 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be

 

applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to

 

about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow)

 

than ordinary solder so use caution not to let solder bridges

 

occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may

 

also be added to ordinary solder.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

This appliance is
claassifi ed as a CLASS 1
LASER product. This
label is located on the
rear exterior.

E2, E51, EA, MY, SAF

4-275-656-0[]

MX

4-275-656-1[]

US

4-275-656-2[]

•  Abbreviation

  E2 

: 120 V AC area in E model

  E51  : Chilean and Peruvian models

  EA 

: Saudi Arabian model

  MX  : Mexican model

  MY  : Malaysia model

  SAF  : South African model

Format of discs

Logo

•  AUDIO CD

• CD-R/-RW in AUDIO

 CD 

format

•  CD-R/-RW in DATA CD

  format, containing MP3

 audio 

tracks 

1)

 that

  conforms to ISO 9660 

2)

  Level 1/Level 2, Joliet

  (in expansion format), or

 Multi 

Session 

3)

1)

  MP3 (MPEG 1 Audio Layer 3) is a standard format defi ned

 

by ISO/MPEG which compresses audio data. MP3 audio

 

tracks must be in MPEG 1 Audio Layer 3 format.

2)

  A logical format of fi les and folders on CD-ROMs, defi ned

 

by ISO (International Organization for Standardization).

3)

  This is a recording method that enables adding of data using

 

the Track-At-Once method. Conventional discs begin at a

 

disc control area called the Lead-in and end at an area called

 

Lead-out. A Multi Session disc is a disc having multiple

 

sessions, with each segment from Lead-in to Lead-out

 

regarded as a single session.

NOTE OF REPLACING THE IC102 AND IC4605 ON THE 
DMB21 BOARD
IC102 and IC4605 on the DMB21 board cannot exchange with 
single. When these parts on the DMB21 board are damaged, 
exchange the entire mounted board.

NOTE OF REPLACEMENT OF THE MS-214 BOARD
When the MS-214 board is defective, exchange the entire MD 
(AU) ASSY.

PART No.