Read Sony HCD-RG550 / HCD-RG660 / MHC-RG550 / MHC-RG660 Service Manual online
1
Ver 1.0 2003. 06
Model Name Using Similar Mechanism
NEW
CD
CD Mechanism Type
CDM74F-K6BD71B
Section
Base Unit Name
BU-K6BD71B
Optical Pick-up Name
KSS-213DCP
Tape Deck
Model Name Using Similar Machanism
CX-JT8
Section
Tape Transport Mechanism Type
CWM43RR-23
SERVICE MANUAL
AEP Model
UK Model
E Model
HCD-RG550/RG660
Amplifier section
European model:
HCD-RG660:
HCD-RG660:
Front speaker
DIN power output (rated):
DIN power output (rated):
160 + 160 watts
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
200 + 200 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Music power output (reference):
400 + 400 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Other models:
HCD-RG660:
HCD-RG660:
The following measured at AC 120, 127, 220, 240 V,
50/60 Hz
DIN power output (rated):
50/60 Hz
DIN power output (rated):
160 + 160 watts
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
200 + 200 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
HCD-RG550:
The following measured at AC 120, 127, 220, 240 V,
50/60 Hz
DIN power output (rated):
50/60 Hz
DIN power output (rated):
115 + 115 watts
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
140 + 140 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
SPECIFICATIONS
Inputs
MD (VIDEO) IN L/R (phono jacks):
MD (VIDEO) IN L/R (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
GAME INPUT AUDIO L/R (phono jacks):
voltage 250 mV,
impedance 47 kilohms
impedance 47 kilohms
GAME INPUT VIDEO (phono jack):
1 Vp-p, 75 ohms
MIC (phone jack) (except for European model):
sensitivity 1 mV,
impedance 10 kilohms
impedance 10 kilohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
8 ohms or more
VIDEO OUT (phono jack):
max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
SPEAKER:
accepts impedance of 6 to
16 ohms
16 ohms
SURROUND SPEAKER (HCD-RG660 only):
accepts impedance of 24
ohms
ohms
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-961-000-01
2003F04-1
© 2003. 06
– Continued on next page –
COMPACT DISC DECK RECEIVER
• HCD-RG550/RG660 is the
tuner, deck, CD and amplifier
section in MHC-RG550/RG660.
section in MHC-RG550/RG660.
(Photo: HCD-RG550)
2
HCD-RG550/RG660
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz (±0.5 dB)
Wavelength
780 – 790 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(square optical connector jack, rear panel)
Wavelength
(square optical connector jack, rear panel)
Wavelength
660 nm
Output
–18 dBm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
using Sony TYPE I
cassettes
Wow and flutter
±0.15% W.Peak (IEC)
0.1% W.RMS (NAB)
±0.2% W.Peak (DIN)
0.1% W.RMS (NAB)
±0.2% W.Peak (DIN)
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Latin American model: 530 – 1,710 kHz (with the tuning
Latin American model: 530 – 1,710 kHz (with the tuning
interval set at 10 kHz)
531 – 1,710 kHz (with the tuning
interval set at 10 kHz)
531 – 1,710 kHz (with the tuning
interval set at 10 kHz)
European, Middle Eastern and Philippine models:
531 – 1,602 kHz (with the tuning
interval set at 9 kHz)
interval set at 9 kHz)
Other models:
530 – 1,710 kHz (with the tuning
interval set at 10 kHz)
531 – 1,602 kHz (with the tuning
interval set at 9 kHz)
interval set at 10 kHz)
531 – 1,602 kHz (with the tuning
interval set at 9 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency 450 kHz
Speaker
Front speaker SS-RG665 for HCD-RG660/RG550:
Speaker system
3-way, 3-unit, bass-reflex
type
type
Speaker units
Sub Woofer:
Sub Woofer:
15 cm, cone type
Woofer:
15 cm, cone type
Tweeter:
5 cm, cone type
Nominal impedance
6 ohms
Dimensions (w/h/d)
Approx. 240
× 363 × 290 mm
Mass
Approx. 4.7 kg net per
speaker
speaker
Surround speaker SS-RS660 for HCD-RG660:
Speaker system
3-way, 3-unit, bass-reflex
type
type
Speaker units
Woofer:
Woofer:
13 cm, cone type
Tweeter:
5 cm, cone type
Super tweeter:
2 cm, dome type
Nominal impedance
24 ohms
Dimensions (w/h/d)
Approx. 195
× 325 × 225 mm
Mass
Approx. 2.3 kg net per
speaker
speaker
General
Power requirements
European model:
European model:
230 V AC, 50/60 Hz
Argentine model:
220 V AC, 50/60 Hz
Mexican model:
127 V AC, 60 Hz
Saudi Arabian model:
120 – 127 V/220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Other models:
120 V, 220 V or 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector
240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
European model:
HCD-RG660:
European model:
HCD-RG660:
190 watts
0.35 watts (at the Power
Saving Mode)
0.35 watts (at the Power
Saving Mode)
Other models:
HCD-RG660:
HCD-RG660:
190 watts
HCD-RG550:
135 watts
Dimensions (w/h/d)
Approx. 280
× 325 × 407 mm
Mass
European model:
HCD-RG660:
European model:
HCD-RG660:
Approx. 10.0 kg
Other models:
HCD-RG660:
HCD-RG660:
Approx. 11.0 kg
HCD-RG550:
Approx. 9.0 kg
Supplied accessories:
AM loop antenna (1)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Speaker pads
HCD-RG660 (16)
HCD-RG550 (8)
Remote Commander (1)
Batteries (2)
FM lead antenna (1)
Speaker pads
HCD-RG660 (16)
HCD-RG550 (8)
Design and specifications are subject to change without
notice.
notice.
3
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
HCD-RG550/RG660
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
– BACK PANEL –
MODEL
PARTS No.
RG550: E2, E3, E51
4-247-996-01
RG550: MX
4-247-996-11
RG660: E3
4-247-996-21
RG660: AEP, UK
4-247-996-31
• Abbreviation
E2
: 120 V AC area in E model
E3
: 240 V AC area in E model
E51
: 220 V AC area in E model
MX
: Mexican model
SETTING AND RELEASING THE CD DISC TRAY LOCK
FUNCTION
FUNCTION
This set has a disc tray lock function to prevent discs for
demonstration at shops from theft. While this lock function is set,
the tray will not be delivered out even when the OPEN/CLOSE
button is pressed.
demonstration at shops from theft. While this lock function is set,
the tray will not be delivered out even when the OPEN/CLOSE
button is pressed.
Setting method:
Press the OPEN/CLOSE button while pressing the STOP button.
After a few seconds, the message “LOCKED” will appear on the
fluorescent indicator tube with the tray locked.
After a few seconds, the message “LOCKED” will appear on the
fluorescent indicator tube with the tray locked.
Releasing method:
Just as the lock is set, press the OPEN/CLOSE button while
pressing the STOP button.
After a few seconds, the message “UNLOCKED” will appear with
the lock released.
pressing the STOP button.
After a few seconds, the message “UNLOCKED” will appear with
the lock released.
PARTS No.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
be added to ordinary solder.
4
TABLE OF CONTENTS
HCD-RG550/RG660
1. GENERAL
Main Unit ................................................................................ 5
Remote Control ....................................................................... 5
Remote Control ....................................................................... 5
2. DISASSEMBLY
2-1. Case (Top) ........................................................................... 7
2-2. CD Door .............................................................................. 7
2-3. CD Mechanism Block ......................................................... 8
2-4. Front Panel Section ............................................................. 9
2-5. Tape Mechanism Deck ...................................................... 10
2-6. Panel Board, 6 Stream Led Board, Remote Board ............ 10
2-7. Jack Board ......................................................................... 11
2-8. Back Panel Section ............................................................ 11
2-9. Main Board ....................................................................... 12
2-10. Power Amp Board ............................................................. 12
2-11. SW Board, Driver Board ................................................... 13
2-12. CD Block Assy .................................................................. 13
2-13. Sensor Board ..................................................................... 14
2-14. Motor (TB) Board ............................................................. 14
2-15. Motor (LD) Board ............................................................. 15
2-16. BD Board .......................................................................... 15
2-17. Optical Pick-up ................................................................. 16
2-2. CD Door .............................................................................. 7
2-3. CD Mechanism Block ......................................................... 8
2-4. Front Panel Section ............................................................. 9
2-5. Tape Mechanism Deck ...................................................... 10
2-6. Panel Board, 6 Stream Led Board, Remote Board ............ 10
2-7. Jack Board ......................................................................... 11
2-8. Back Panel Section ............................................................ 11
2-9. Main Board ....................................................................... 12
2-10. Power Amp Board ............................................................. 12
2-11. SW Board, Driver Board ................................................... 13
2-12. CD Block Assy .................................................................. 13
2-13. Sensor Board ..................................................................... 14
2-14. Motor (TB) Board ............................................................. 14
2-15. Motor (LD) Board ............................................................. 15
2-16. BD Board .......................................................................... 15
2-17. Optical Pick-up ................................................................. 16
3. TEST MODE
..................................................................... 17
4. ELECTRICAL ADJUSTMENTS
................................. 20
5. DIAGRAMS
5-1. IC Pin Descriptions ........................................................... 21
5-2. Block Diagram –CD Section– ........................................... 25
5-3. Block Diagram –Tuner/Tape/Panel Section– .................... 26
5-4. Block Diagram –Amp/Power Supply Section– ................. 27
5-5. Circuit Boards Location .................................................... 28
5-6. Note for Printed Wiring Boards
5-2. Block Diagram –CD Section– ........................................... 25
5-3. Block Diagram –Tuner/Tape/Panel Section– .................... 26
5-4. Block Diagram –Amp/Power Supply Section– ................. 27
5-5. Circuit Boards Location .................................................... 28
5-6. Note for Printed Wiring Boards
and Schematic Diagrams .................................................. 29
5-7. Waveforms ......................................................................... 29
5-8. Printed Wiring Board –CD Mechanism Section (1/2)– .... 30
5-9. Schematic Diagram –CD Mechanism Section (1/2)– ....... 31
5-10. Printed Wiring Boards –CD Mechanism Section (2/2)– ... 32
5-11. Schematic Diagram –CD Mechanism Section (2/2)– ....... 33
5-12. Schematic Diagram –Main Section (1/4)– ........................ 34
5-13. Schematic Diagram –Main Section (2/4)– ........................ 35
5-14. Schematic Diagram –Main Section (3/4)– ........................ 36
5-15. Schematic Diagram –Main Section (4/4)– ........................ 37
5-16. Printed Wiring Board –Main Section– .............................. 38
5-17. Printed Wiring Boards –Panel Section– ............................ 39
5-18. Schematic Diagram –Panel Section– ................................ 40
5-19. Printed Wiring Boards –Jack Section– .............................. 41
5-20. Schematic Diagram –Jack Section– .................................. 42
5-21. Printed Wiring Board –Power Amp Section– ................... 43
5-22. Schematic Diagram –Power Amp Section (1/2)– ............. 44
5-23. Schematic Diagram –Power Amp Section (2/2)– ............. 45
5-24. Printed Wiring Board
5-8. Printed Wiring Board –CD Mechanism Section (1/2)– .... 30
5-9. Schematic Diagram –CD Mechanism Section (1/2)– ....... 31
5-10. Printed Wiring Boards –CD Mechanism Section (2/2)– ... 32
5-11. Schematic Diagram –CD Mechanism Section (2/2)– ....... 33
5-12. Schematic Diagram –Main Section (1/4)– ........................ 34
5-13. Schematic Diagram –Main Section (2/4)– ........................ 35
5-14. Schematic Diagram –Main Section (3/4)– ........................ 36
5-15. Schematic Diagram –Main Section (4/4)– ........................ 37
5-16. Printed Wiring Board –Main Section– .............................. 38
5-17. Printed Wiring Boards –Panel Section– ............................ 39
5-18. Schematic Diagram –Panel Section– ................................ 40
5-19. Printed Wiring Boards –Jack Section– .............................. 41
5-20. Schematic Diagram –Jack Section– .................................. 42
5-21. Printed Wiring Board –Power Amp Section– ................... 43
5-22. Schematic Diagram –Power Amp Section (1/2)– ............. 44
5-23. Schematic Diagram –Power Amp Section (2/2)– ............. 45
5-24. Printed Wiring Board
–Transformer Section (HCD-RG550)– ............................. 46
5-25. Printed Wiring Board
–Transformer Section (HCD-RG660)– ............................. 47
5-26. Schematic Diagram –Transformer Section– ..................... 48
5-27. IC Block Diagrams ............................................................ 49
5-27. IC Block Diagrams ............................................................ 49
6. EXPLODED VIEWS
6-1. Main Section ..................................................................... 52
6-2. Front Panel Section (1) ...................................................... 53
6-3. Front Panel Section (2) ...................................................... 54
6-4. Front Panel Section (3) ...................................................... 55
6-5. Main Board Section .......................................................... 56
6-6. CD Mechanism Deck Section (1) ..................................... 57
6-7. CD Mechanism Deck Section (2) ..................................... 58
6-8. Base Unit Section .............................................................. 59
6-2. Front Panel Section (1) ...................................................... 53
6-3. Front Panel Section (2) ...................................................... 54
6-4. Front Panel Section (3) ...................................................... 55
6-5. Main Board Section .......................................................... 56
6-6. CD Mechanism Deck Section (1) ..................................... 57
6-7. CD Mechanism Deck Section (2) ..................................... 58
6-8. Base Unit Section .............................................................. 59
7. ELECTRICAL PARTS LIST
........................................ 60