BDV-B1, HBD-B1 - Sony Audio Service Manual (repair manual). Page 4

Read Sony BDV-B1 / HBD-B1 Service Manual online

HBD-B1
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• AMP+SMPS 
board
 
C900, C952, C953, C962
– AMP+SMPS Board (Conductor Side) –
C962
C952
C900
C953
Connect resistor 
(about 100 
:/2 W) 
for 2 seconds.
Connect resistor 
(about 100 
:/10 W) 
for 2 seconds.
Connect resistor 
(about 100 
:/10 W) 
for 2 seconds.
Connect resistor 
(about 1 k
:/10 W) 
for 3 seconds.
NOTE  THE  PARTS  ON  THE  EACH  BOARDS  REPAIR-
ING
The mount parts on each boards installed in this set cannot ex-
change with single excluding a part of parts.
Refer to ELECTRICAL PARTS LIST (page 39) for parts that can 
be exchanged.
When the each mount parts that have not been described to ELEC-
TRICAL PARTS LIST are damaged, exchange the entire mounted 
board.
Printed wiring board and schematic diagram have been described 
to this service manual is for the reference.
Page of 40
Display

Click on the first or last page to see other BDV-B1 / HBD-B1 service manuals if exist.