Read Harman Kardon DPR 2005 EMC - CB Certificate online
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IEC 60065, 6th edition : 1998
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- Page 11 of 41 -
Order
No.
24776
HEATING (continued)
P
Other measured parts (continued)
∆t measured
at 207V
at 207V
∆t measured
at 253V
at 253V
∆t allowed *)
Top enclosure above HS102 heat-sink
14,5
15,9
40
Top enclosure above Amp. Module
5,6
5,2
40
Amp. Module body
17,4
18,6
-
Appliance inlet body
11,7
12,4
60
Switch button (standby / on)
0,8
1,5
50
Comments
No other parts were observed to create any hazard due to temperature rise.
P
*) Temperature rise limits for Singapore is 10K less.
P
7.2
Softening temperature of insulating
material supporting parts
conductively connected to the mains
carrying a current > 0,2 A at least
150
material supporting parts
conductively connected to the mains
carrying a current > 0,2 A at least
150
°C
No temperatures measured during heating test and fault
cond. tests requires this test (7.2) to be performed.
cond. tests requires this test (7.2) to be performed.
N
Tested parts
Temperature
under normal
operating con-
ditions (°C)
under normal
operating con-
ditions (°C)
Temperature
under fault
conditions
(°C)
under fault
conditions
(°C)
Softening
Temperature
(°C)
Temperature
(°C)
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